NOCTUA NT-H1 10G, PRO-GRADE THERMAL COMPOUND PASTE (10G)
Noctua’s NT-H1 is a renowned hybrid thermal compound that has received more than 150 awards and recommendations from international hardware websites and magazines. Thanks to its excellent performance, exceptional ease of use and outstanding long-term stability, it has become an established favourite among overclockers and enthusiast users worldwide. Whether it’s air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H1 is a proven premium paste that’s guaranteed to deliver great results.
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Bundled with Noctua’s premium-grade CPU coolers since 2007, NT-H1 has proven its excellent performance in countless tests and reviews. Chosen again and again by overclockers and hardware enthusiasts around the globe, it has established itself as a benchmark for premium-quality thermal interface materials (TIMs).
Easy to apply
Thanks to its excellent spreading properties, there is no need to manually spread NT-H1 before installing the cooler: Simply apply some paste onto the CPU (see instructions for details), put it on the heatsink and you’re ready to go!
Easy to clean
NT-H1 is one of the easiest to clean thermal compounds on the market: Simply wipe it off the CPU and heatsink with a dry tissue or paper towel, then wipe them clean with a moist tissue or towel. No cleaning alcohol or solvent is required!
ot electrically conductive, non-corroding
While some high-end thermal compounds and pads are risky to use due to their electrical conductivity or corroding properties, there’s no risk of short-circuits with NT-H1 and it’s completely safe to use with any type of CPU cooler, regardless of whether it’s made from copper or aluminum and whether it’s nickel-plated or not.
Excellent long-term stability
NT-H1’s unique formula is highly stable over time, even after long periods of usage. It can be stored at room temperature for at least 3 years and due to the compound’s exceptional curing, bleeding, dry-out, and thermal cycling characteristics, it can be used on the CPU for 5 years or more
No break-in or burn-in required
Some thermal compounds need a longer break-in period or cure time until they reach their full performance and some thermal pads must undergo a dedicated burn-in process. By contrast, NT-H1 is ready to go right away and doesn’t require any special preparations.
Extra-large 10g package for 9-60 applications
Sufficient for around 9-60 applications (depending on the size of the CPU or GPU, e.g. around 9 applications for large CPUs such as TR4 and around 60 for small CPUs such as LGA1151), the extra-large 10g packaging size is ideal for power users who install coolers frequently.
Notes and warnings
NT-H1 further reading:
Performance comparison NT-H1 vs. NT-H2
How to apply NT-H1 on smaller-sized CPUs (e.g. Intel LGA1150, LGA1151, LGA1155, LGA1156, LGA1200)
How to apply NT-H1 on medium-sized CPUs (e.g. AMD AM4, Intel LGA2011 & LGA2066)
How to apply NT-H1 on larger-sized CPUs (e.g. AMD TR4, Intel LGA3647)
|Recommended storage time (before use)||up to 3 years|
|Recommended usage time (on the CPU)||up to 5 years|
|Recommended storage temperature||room temperature|
|Operating temperature||-50 to 110°C|
|NOTE||* Features, Price, Specifications are subject to change without notice.|
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