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AMD Ryzen 5 5600 Desktop Processor
FEATURES
Total Redesign
The “Zen 3” architecture represents the most comprehensive design overhaul of the “Zen” era. Over 20 major changes include: wider and more flexible execution resources; significantly more load/store bandwidth to feed execution; and a streamlined front-end to get more threads in flight—and do it faster.
Higher Instructions Per Clock (IPC)
The “Zen 3” architecture can extract an average of 19% additional performance from every MHz of frequency relative to the previous generation2. This a historically large generational improvement in IPC, and a major player in the architecture’s ability to deliver unmatched single-core performance1.
Lower Latency
The “Zen 3” architecture transitions to a new “unified complex” design that brings 8 cores and 32MB of L3 cache into a single group of resources. This dramatically reduces core-to-core and core-to-cache latencies by making every element of the die a next-door neighbor with minimal communication time. Latency-sensitive tasks like PC gaming especially benefit from this change, as tasks now have direct access to twice as much L3 cache versus “Zen 2.”
King of the Hill
The combination of higher IPC and the unified 8-core complex are a potent combination for PC games. Customers upgrading from the AMD Ryzen™ 3000 Series to the 5000 Series can expect an average of 26% better gaming performance at 1080p3. But that’s not all: processors with “Zen 3,” like the AMD Ryzen™ 9 5900X, are the best in the world for PC gaming4.
Incredible Efficiency
Impressively, the performance gains of the “Zen 3” architecture can be delivered with no increase to power consumption or TDP. The combination of a state-of-the-art architecture and industry-leading 7nm process give the AMD Ryzen™ 5000 Series a +24% generational improvement in energy efficiency5, and a stunning 2.8X lead over competing architectures6.
AMD Ryzen™ VR Ready Premium
For users who demand a premium VR experience, AMD offers high-performance Ryzen™ VR Ready Premium processors1. These select models meet or exceed the current top VR-HMD manufacturers Oculus Rift, HTC Vive, or Windows® Mixed Reality recommended specifications for processors, helping ensure the best possible experiences within the virtual worlds you choose.
AMD VR Ready Processor
If you feel that VR is something you might want to try now or in the future, AMD VR Ready processors2 provide confidence that your system has enough processing power to handle this advanced workload. These select models meet or exceed the current top VR-HMD manufacturers Oculus Rift, HTC Vive, or Windows® Mixed Reality minimum specifications for processors to provide a playable experience for the user.
SPECIFICATIONS
General Specifications |
|
| Platform | Desktop |
| Market Segment | Mainstream Desktop |
| Product Family | AMD Ryzen™ Processors |
| Product Line | AMD Ryzen™ 5 Desktop Processors |
| Consumer Use | Yes |
| Regional Availability | Global, NA, EMEA, APJ, LATAM |
| Former Codename | “Vermeer” |
| Architecture | “Zen 3” |
| # of CPU Cores | 6 |
| Multithreading (SMT) | Yes |
| # of Threads | 12 |
| Max. Boost Clock | Up to 4.4GHz |
| Base Clock | 3.5GHz |
| L1 Cache | 384KB |
| L2 Cache | 3MB |
| L3 Cache | 32MB |
| Default TDP | 65W |
| Processor Technology for CPU Cores | TSMC 7nm FinFET |
| Processor Technology for I/O Die | 12nm (Globalfoundries) |
| CPU Compute Die (CCD) Size | 74mm² |
| I/O Die (IOD) Size | 125mm² |
| Package Die Count | 2 |
| Unlocked for Overclocking | Yes |
| CPU Socket | AM4 |
| Socket Count | 1P |
| Supporting Chipsets | X570 X470 X370 B550 B450 B350 A520 |
| CPU Boost Technology | Precision Boost 2 |
| Instruction Set | x86-64 |
| Supported Extensions | AES, AMD-V, AVX, AVX2, FMA3, MMX(+), SHA, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSE4A, SSSE3, x86-64 |
| Thermal Solution (PIB) | AMD Wraith Stealth |
| Max. Operating Temperature (Tjmax) | 90°C |
| *OS Support | Windows 11 – 64-Bit Edition Windows 10 – 64-Bit Edition RHEL x86 64-Bit Ubuntu x86 64-Bit *Operating System (OS) support will vary by manufacturer. |
Connectivity |
|
| USB Type-C® Support | Yes |
| Native USB 3.2 Gen 2 (10Gbps) Ports | 4 |
| Native USB 3.2 Gen 1 (5Gbps) Ports | 0 |
| Native USB 2.0 (480Mbps) Ports | 0 |
| Native SATA Ports | PCI Express® Version |
| Native PCIe® Lanes (Total/Usable) | 24/20 |
| Additional Usable PCIe Lanes from Motherboard | AMD X570 16x Gen 4AMD X470 2x Gen 3AMD X470 8x Gen 2 |
| NVMe Support | Boot, RAID0, RAID1, RAID10 |
| System Memory Type | DDR4 |
| Memory Channels | 2 |
| Max. Memory | 128GB |
| System Memory Subtype | UDIMM |
| System Memory Specification | Up to 3200MHz |
| Max Memory Speed | 2x1R DDR4-32002x2R DDR4-32004x1R DDR4-29334x2R DDR4-2667 |
| ECC Support | Yes (Requires mobo support) |
Graphics Capabilities |
|
| Integrated Graphics | No |
| Graphics Model | Discrete Graphics Card Required |
Key Features |
|
| Supported Technologies | AMD StoreMI Technology AMD “Zen 3” Core Architecture AMD Ryzen™ VR-Ready Premium |
| Warranty | 3 Years |
| Note | *Price, feature and specifications are subject to change without notice. |
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